AMD Ryzen 7 5825U

AMD Ryzen 7 5825U

AMD CPU
-
发布日期:2022-01-06

The AMD Ryzen 7 5825U is a mobile processor with 8 cores, launched in January 2022. It is part of the Ryzen 7 lineup, using the Zen 3 (Cezanne) architecture with Socket FP6. Thanks to AMD Simultaneou

产品图集

AMD Ryzen 7 5825U - 图片1
AMD Ryzen 7 5825U - 图片2

产品详情

The AMD Ryzen 7 5825U is a mobile processor with 8 cores, launched in January 2022. It is part of the Ryzen 7 lineup, using the Zen 3 (Cezanne) architecture with Socket FP6. Thanks to AMD Simultaneous Multithreading (SMT) the core-count is effectively doubled, to 16 threads. Ryzen 7 5825U has 16 MB of L3 cache and operates at 2000 MHz by default, but can boost up to 4.5 GHz, depending on the workload. AMD is building the Ryzen 7 5825U on a 7 nm production process using 10,700 million transistors. The silicon die of the chip is not fabricated at AMD, but at the foundry of TSMC. The multiplier is locked on Ryzen 7 5825U, which limits its overclocking capabilities.
With a TDP of 15 W, the Ryzen 7 5825U consumes very little energy. AMD's processor supports DDR4 memory with a dual-channel interface. The highest officially supported memory speed is 3200 MT/s. ECC memory is supported, too, which is an important capability for mission-critical systems, to avoid data corruption. For communication with other components in the system, Ryzen 7 5825U uses a PCI-Express Gen 3 connection. This processor features the Radeon Vega 8 integrated graphics solution.
Hardware virtualization is available on the Ryzen 7 5825U, which greatly improves virtual machine performance. Programs using Advanced Vector Extensions (AVX) will run on this processor, boosting performance for calculation-heavy applications. Besides AVX, AMD is including the newer AVX2 standard, too, but not AVX-512.

基础信息

型号AMD Ryzen 7 5825U
品牌AMD
分类CPU
参考价格-
发布日期2022-01-06

CPU特性参数

核心数8
线程数16
基础频率0.00 GHz
加速频率4.50 GHz
基础时钟100.00 MHz
倍频20.00x
倍频解锁
制程工艺7 nm
TDP功耗15 W
接口类型FP6
代号Barcelo
代次Ryzen 7 (Zen 3 (Cezanne))
市场定位Mobile
型号/部件号100-000000580
代工厂TSMC
晶体管数量10,700 million
芯片尺寸180 mm²
封装类型FC-BGA1140
内存支持DDR4
内存速度3200 MT/s
内存总线Dual-channel
内存带宽51.2 GB/s
ECC内存支持
PCIe版本Gen 3
PCIe通道数16
L1缓存64 KB (per core)
L2缓存512 KB (per core)
L3缓存16 MB (shared)
集成显卡Radeon Vega 8

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