The AMD Ryzen 7 7730U is a mobile processor with 8 cores, launched in January 2023. It is part of the Ryzen 7 lineup, using the Zen 3 (Cezanne) architecture with Socket FP6. Thanks to AMD Simultaneous Multithreading (SMT) the core-count is effectively doubled, to 16 threads. Ryzen 7 7730U has 16 MB of L3 cache and operates at 2000 MHz by default, but can boost up to 4.5 GHz, depending on the workload. AMD is building the Ryzen 7 7730U on a 7 nm production process using 10,700 million transistors. The silicon die of the chip is not fabricated at AMD, but at the foundry of TSMC. The multiplier is locked on Ryzen 7 7730U, which limits its overclocking capabilities.
With a TDP of 15 W, the Ryzen 7 7730U consumes very little energy. AMD's processor supports DDR4 memory with a dual-channel interface. The highest officially supported memory speed is 3200 MT/s. ECC memory is supported, too, which is an important capability for mission-critical systems, to avoid data corruption. For communication with other components in the system, Ryzen 7 7730U uses a PCI-Express Gen 3 connection. This processor features the Radeon Graphics (Vega 8) integrated graphics solution.
Hardware virtualization is available on the Ryzen 7 7730U, which greatly improves virtual machine performance. Programs using Advanced Vector Extensions (AVX) will run on this processor, boosting performance for calculation-heavy applications. Besides AVX, AMD is including the newer AVX2 standard, too, but not AVX-512.
AMD Ryzen 7 7730U
AMD
CPU
-
发布日期:2023-01-04
The AMD Ryzen 7 7730U is a mobile processor with 8 cores, launched in January 2023. It is part of the Ryzen 7 lineup, using the Zen 3 (Cezanne) architecture with Socket FP6. Thanks to AMD Simultaneou
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基础信息
| 型号 | AMD Ryzen 7 7730U |
| 品牌 | AMD |
| 分类 | CPU |
| 参考价格 | - |
| 发布日期 | 2023-01-04 |
CPU特性参数
| 核心数 | 8 |
| 线程数 | 16 |
| 基础频率 | 0.00 GHz |
| 加速频率 | 4.50 GHz |
| 基础时钟 | 100.00 MHz |
| 倍频 | 20.00x |
| 倍频解锁 | 否 |
| 制程工艺 | 7 nm |
| TDP功耗 | 15 W |
| 接口类型 | FP6 |
| 代号 | Barcelo-R |
| 代次 | Ryzen 7 (Zen 3 (Cezanne)) |
| 市场定位 | Mobile |
| 型号/部件号 | 100-000000942 |
| 代工厂 | TSMC |
| 晶体管数量 | 10,700 million |
| 芯片尺寸 | 180 mm² |
| 封装类型 | FC-BGA1140 |
| 内存支持 | DDR4 |
| 内存速度 | 3200 MT/s |
| 内存总线 | Dual-channel |
| 内存带宽 | 51.2 GB/s |
| ECC内存 | 支持 |
| PCIe版本 | Gen 3 |
| PCIe通道数 | 16 |
| L1缓存 | 64 KB (per core) |
| L2缓存 | 512 KB (per core) |
| L3缓存 | 16 MB (shared) |
| 集成显卡 | Radeon Graphics (Vega 8) |
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